AGX ORIN 64GB, HDMI, 1 x GbE, 1 x 10GbE, 4 x PoE, -25°C ~ 80

  • Processor : NVIDIA Jetson
  • Max geheugen : 64GB
  • Operating Temperatuur : -25°C/+80°C
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● 8 x AI performance enables AI inference with low latency
NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than NVIDIA® Jetson AGX Xavier™ 32GB module. Built in up to 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin module enables server-class AI inference at the edge with low latency.

● Comprehensive M.2 expansion and LAN ports
AIB-MX11/12/21/22 is a platform with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 E-Key for Wifi/BT and 1x M.2 M-Key for storage. For network, on-board 2 or 4x PSE ports support 2 or 4x POE cameras, and 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard.

● Wide input power and operating temperature for various embedded applications
To meet various embedded applications, especially challenging environments in smart factory, smart city, and smart transportation, AIB-MX11/12/21/22 supports operating temperature ranging from -25°C to 80°C and wide input power from 9 to 36VDC.
  • Processor
    ProcessorNVIDIA Jetson
    Aantal cores12
  • Geheugen
    Max geheugen64GB
  • Video
    1 x HDMI 2.0 Type A
    Chipset2048-core NVIDIA Ampere GPU with 64 Tensor Cores
  • Belangrijkste eigenschappen
    KenmerkenAI Performance
    275 TOPS

    PoE Interface

    IEEE 802.3af compliant, Power Output 15W per Port
  • Uitbreidingsmogelijkheden
    Uitbreiding slotsM.2
    1 x M.2 B-Key 3042/3052 (LTE/4G/5G, USB 3.2/USB 2.0)
    1 x M.2 E-Key 2230 (WiFi/BT, PCIe/USB 2.0)
  • Poorten & Interfaces
    LAN poorten6
    Seriele poorten2
    USB 2.0 poorten1
    USB 3.x poorten4
    Audio interfaceLine-out/Line-in/Mic (optional with daughter board)
    Externe I/OLAN
    1 x RJ-45 GbE port
    1 x RJ-45 10GbE port
    4 x RJ-45 GbE PSE

    I/O Interfaces
    2 x UART
    1 x UART (Debug only)
    1 x RS-232
    1 x RS-422 / RS-485
    2 x CAN 2.0b with isolation
    2 x I2C
    1 x I2S
    1 x SPI
    5 x GPIO
    2 x 3.3VDC/0.5A
    3 x 5VDC/0.5A
    1 x 12VDC/0.5A

    2 x USB 3.2 Gen1 Type A
    1 x OTG Type-C
    1 x USB 3.2 Gen2 Type-C
    1 x USB 2.0
  • Opslag
    Opslag interfaceeMMC
    1 x 64GB eMMC 5.1

    1 x M.2 M-Key 2280 (supports NVMe, PCIe)

    SD Card
    1 x microSD Card Slot
  • Mechanische specificaties
    Afmetingen176 x 132 x 57.32 mm (6.93 x 5.19 x 2.26 in)
  • Product eigenschappen
    Gewicht0.980 kg (2.161 lb) w/ Fansink
  • Electrische specificaties
    Input rangeDC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector
    Power consumptionIdle: 12 W, Full Loading: 132* W
  • Omgeving specificatie
    Opslag temperatuur-40°C ~ +85°C
    Operating Temperatuur-25°C/+80°C
    Relatieve luchtvochtigheid95% @ 40°C (104°F) (non-condensing)
  • Certificeringen
    1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis

    10 G, IEC 60068-2-27, half sine, 11 ms duration
    certificatenCE / FCC Class A / UKCA
  • Software support
    Operating systeemUbuntu 20.04
  • Generieke data
    MarktsegmentAutomation, Datacenter , IoT, In-vehicle, Medical

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