XMC module XCZU7EV AXM Front I/O rugged air-cooled

SKU:
XMC-FZU7EV-42-30
Fabrikant:
Acromag
  • Prozessor-Typ : ARM
  • Max. Speicher : 8GB
  • Typ SBC : XMC Board
  • Betriebstemperatur : 0°C/+70°C
XMC module XCZU7EV AXM Front I/O rugged air-cooled
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XMC-FZU Series: Configurable Zynq® UltraScale+TM MPSoC with Plug-In I/O Description

XMC-FZU series modules provide a programmable AMD Zynq UltraScale+ multiprocessor system on a chip (MPSoC). This MPSoC combines a feature-rich ARM-based processing system and programmable logic in a single device. Two multi-core ARM Cortex CPUs (A53 application processor and R5 real-time processor) deliver high-performance computation capability. Additional resources include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces. The integrated ASIC-class programmable logic is ideal for compute-intensive tasks and offloading critical applications.

An AXM-FZU01 expansion I/O module with dual QSFP+ ports plugs in to interface high-speed signals, such as 10GbE, to the programmable logic. Other AXM mezzanine modules can support a variety of fiber optic or LVDS I/O interfaces.

The rear XMC connectors route peripheral I/O to the processor system and high-speed serial lanes for PCIe, Serial RapidIO or 10-Gigabit Ethernet. Additional user I/O such as high speed serial, LVDS or global clock signals can also access the programmable logic over the rear connectors.

The real value of the Zynq UltraScale+ MPSoC architecture lies in the tight integration of its programmable logic with the processing system. Its high throughput interface eliminates bottlenecks that plague two-chip ASSP-FPGA solutions and allows designers to easily extend the processing system capabilities. Now developers can build custom designs by adding peripherals in the programmable logic and increase overall system performance by partitioning hardware and software functions with custom accelerators.

Designed for COTS applications these MPSoC I/O modules deliver user-customizable I/O in a high-density and very rugged form factor. Typical applications involve adaptive filtering, sensor fusion, motor control, and image processing.

Acromag’s Engineering Design Kit (EDK) provides example designs that provides host access to the hardware I/O. The examples are implemented using the Xilinx Vivado® development environment and offer a starting point from which customers can develop their customized applications. Vitis® and PetaLinux® examples are also provided.
Weitere Informationen
  • Prozessor
    Prozessor-TypARM
    Prozessor-SerieAMD Zynq UltraScale+ MPSoC
    TaktfrequenzApplication processor: Quad-core ARM Cortex-A53, up to 1.5GHz.
    Real-time processor: Dual-core ARM Cortex-R5, up to 600MHz.
    Anzahl Cores4
    ChipsatzSoC
  • Arbeitsspeicher
    SpeichertypDDR4
    Max. Speicher8GB
  • Video
    AnschlüsseDisplayPort
    P16: 1x DisplayPort
    ChipsatzMali™-400 MP2 up to 667MHz
  • Wesentliche Merkmale
    HauptmerkmaleZynq MPSoC
    • Quad-core ARM Cortex A53-based application processing unit (APU)
    • Dual-core ARM Cortex R5-based real-time processor unit (RPU)
    • Mali™-400 GPU
    • H.264/265 video codec
    • UltraScale+ 504k programmable logic cells
    • Extensive on-chip memory

    I/O and Peripherals
    • Gigabit Ethernet interface
    • USB 3.0 and USB-UART ports
    • DisplayPort
    • LVDS I/O

    General
    • PCI Express Gen 3 x8 interface
    • MicroSD or NOR flash boot
    • Dual Quad-SPI flash memory
    • 8GB DDR4 storage memory
    • DMA transfers
    • BSP and MPSoC design kit software
    • VxWorks®, Linux®, and Windows® support
  • Erweiterungsmöglichkeiten
    ErweiterungssteckplätzePCIe Interface
    PCIe bus 8-lane (x8) Gen 3 interface
  • Ports & Schnittstellen
    LAN-Anschlüsse1
    USB 3.x-Anschlüsse1
    Externe I/OAXM Mezzanine I/O
    AXM modules plug into the XMC module’s front mezzanine for additional I/O lines. Analog, digital, and peripheral I/O AXM modules are sold separately.

    Front I/O to Programmable Logic
    AXM J1 & J2: 20 high-performance 1.8V I/O,8 GTH 16.3Gb/s lines.

    Rear I/O to Programmable Logic
    P4: 30 LVDS pairs, 2 global clock pairs.
    P15: 8 high-speed (16.3Gb/s) serial lanes for PCIe, Serial RapidIO, or 10GbE.

    Rear I/O to Processing System
    P16: Tri-mode Gigabit Ethernet 10/100/1000, USB 3.0, USB-UART, DisplayPort, 3 GTR 6Gb/s lines
  • Speicher
    Speicherkapazität64 GB
    SpeicherschnittstelleeMMC Flash
    1x 64GB eMMC

    SD Card
    1x 16GB Industrial MLC microSD card pre-programmed with boot.bin
  • Mechanische Spezifikation
    Typ SBCXMC Board
  • Umgebungsbedingungen
    Lagertemperatur-55°C/+125°C
    Betriebstemperatur0°C/+70°C
    Relative Luftfeuchtigkeit5% to 95% non-condensing.
  • Allgemeine Daten
    HerstellerAcromag
    AnwendungAutomatisierung
    Gewährleistung24 Monate

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